Embedded Sensors and Smart Structures

Solidica’s proprietary Ultrasonic Consolidation (UC) process combines the unique capability to ‘grow’ metal enclosures that deliver revolutionary ruggedness and resilience to harsh-environment sensing applications.  The result is a unique, extremely robust range of applications that meet a wide array of previously unmet market needs.

Metal-encased Sensors

Ultra-rugged packaging of the Pantheon™ system elements enables unparalleled sensor ruggedness.  Such feature is accomplished via Solidica’s proprietary Ultrasonic Consolidation process, and delivers a wide range of system applications, such as:  

• Consumer goods with embedded wireless monitors
  and sensing systems
• Earth-moving equipment sensors
• Mining and geophysical exploration sensor systems
• Many others

Potted Technologies

With the versatility of the additive and subtractive nature of the Ultrasonic Consolidation technology, Solidica is able to implant sensing and telematics systems into various geometries for an equally wide range of applications:

• Medical implants with embedded wireless smart
  sensors
• Vehicular planetary gear sensors
• Submerged, under-water structure sensors
• Many others

Covert Sensing Systems

Via the Ultrasonic Consolidation process, Solidica can ‘grow’ metal geometries that encase sensor/telematics systems to covertly blend into their metallic environment. The result is an ultra-robust, tamperproof smart structure imperceptible to onlookers, such as:

• Threat sensing and identification
• Perimeter monitoring and control systems
• Facility integrity sensors
• Logistics monitoring sensing and identification
  systems
• Many others